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NTD5805N, NVD5805N
Power MOSFET
40 V, 51 A, Single N ? Channel, DPAK
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
V (BR)DSS
http://onsemi.com
R DS(on) MAX
I D MAX
?
Qualified and PPAP Capable
These Devices are Pb ? Free and are RoHS Compliant
40 V
16 m W @ 5.0 V
9.5 m W @ 10 V
51 A
Applications
? LED Backlight Driver
? CCFL Backlight
? DC Motor Control
? Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
D
S
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Symbol
V DSS
V GS
Value
40
" 20
Unit
V
V
N ? CHANNEL MOSFET
4
Current (R q JC )
Gate ? to ? Source Voltage
? Non ? Repetitive (t p < 10 m S)
Continuous Drain
(Note 1) Steady
State
Power Dissipation
(R q JC ) (Note 1)
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
V GS
I D
P D
" 30
51
36
47
V
A
W
1 2
3
CASE 369C
DPAK
(Surface Mount)
STYLE 2
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 50 V, V GS = 10 V, R G = 25 W ,
I L(pk) = 40 A, L = 0.1 mH, V DS = 40 V)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I DM
T J , T stg
I S
E AS
T L
85
? 55 to
175
30
80
260
A
° C
A
mJ
° C
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1 Drain 3
Gate Source
THERMAL RESISTANCE MAXIMUM RATINGS
Y
= Year
Parameter
Junction ? to ? Case (Drain)
Symbol
R q JC
Value
3.2
Unit
° C/W
WW
5805N
G
= Work Week
= Device Code
= Pb ? Free Package
Junction ? to ? Ambient ? Steady State (Note 1)
R q JA
107
1. Surface ? mounted on FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
April, 2012 ? Rev. 4
1
Publication Order Number:
NTD5805N/D
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